Method of fabricating semiconductor device

ABSTRACT

Method of fabricating thin-film transistors in which contact with connecting electrodes becomes reliable. When contact holes are formed, the bottom insulating layer is subjected to a wet etching process, thus producing undercuttings inside the contact holes. In order to remove the undercuttings, a light etching process is carried out to widen the contact holes. Thus, tapering section are obtained, and the covering of connection wiring is improved.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a method of fabricating a semiconductordevice, using a crystalline thin-film semiconductor and, moreparticularly, to a method of fabricating planar type thin-filmtransistors.

2. Description of Related Art

In recent years, techniques for fabricating thin-film transistors (TFTs)on cheap glass substrates have evolved rapidly, because there is anincreasing demand for active matrix liquid crystal displays.

An active matrix liquid crystal display has millions of pixels arrangedin rows and columns. TFTs are arranged at these pixels. Electric chargegoing in and out of each electrode at the pixels is controlled by theswitching action of the TFTs.

Therefore, if one TFT fails to operate, then pixel electrodes connectedwith the faulty TFT do not act as display elements. This gives rise to aso-called point defect. For example, in the case of a normally blackliquid crystal display, when white color is displayed, the point defectappears as a black point, which is deeply harmful to the appearance.Furthermore, it has been required that a circuit (known as a peripheraldriver circuit) for driving TFTs for displaying these pixel electrodesbe formed out of TFTs integrated with the former TFTs on the same glasssubstrate.

In this case, if one driving TFT fails to operate, all TFTs applied witha driving voltage from the faulty TFT do not act as switching elements.This results in a so-called line defect. This is a fatal hindrance tothe liquid crystal display.

Accordingly, in an active matrix liquid crystal display, millions ofTFTs must operate normally and stably over a long term. However, thepresent situation is that it is difficult to eliminate point defects andline defects perfectly. One of the causes is poor contact. Poor contactis that an interconnect electrode is poorly electrically connected withan associated TFT at a contact location, thus a defective operation isoccurred. Especially, in the case of a planar TFT, poor contact presentsserious problems, because an interconnect electrode is electricallyconnected with an associated TFT through a thin contact hole.

The poor contact is a main cause of premature deterioration ofsemiconductor device characteristics. Especially, where large currentsflow or the device is operated at high temperatures, the deteriorationcoursed by the poor contact is promoted. Therefore, it is said that thereliability of contacts determines the reliability of the semiconductordevice.

Generally, in the case of pixel display regions of an active matrixliquid crystal display, the gate electrodes are brought out of the pixeldisplay regions directly and so no contacts exist. That is, contact withthe pixel electrodes is very important for the reliability of the liquidcrystal display.

In the case of a peripheral driver circuit, very many (from tens ofthousands to millions) contacts exist. Especially, because there existgate electrode contacts, and because the temperature is elevated bylarge-current operation, the contacts must have higher reliability thanthe pixel display regions.

SUMMARY OF THE INVENTION

The causes of poor contact are classified into three major categories.

The first category is that a conductive film forming interconnectelectrodes is not in ohmic contact with a semiconductor film forming thesource/drain regions of TFTs. This is caused by formation of aninsulating coating such as a metal oxide at the junction plane. Also,the states of the vicinities of the semiconductor film surface (dopingconcentration, defect level density, cleanliness, and so on) greatlyaffect the performance of the contacts.

The second category is that the conductive film forming the interconnectelectrodes has poor coverage and thus the interconnect line breakswithin a contact hole. In this case, it is necessary to improve thesituation by the method of forming the interconnect electrodes orchanging the film growth conditions better.

The third category is that an interconnect electrode breaks due to thecross-sectional shape of the contact hole. The cross-sectional shape ofthe contact hole depends heavily on the conditions under which theinsulators (SiN, SiO₂, etc.) covered with the contact portions areetched.

In order to form contacts with good coverage, it is desired to have acontinuously mildly changing cross-sectional shape, or a tapering shape.Overetch of the underlying films (wedge-shape recess) which is oftenencountered with insulating films between plural layers severelydeteriorates the coverage.

It is an object of the present invention to provide a semiconductordevice having contact holes through which interconnect electrodes areelectrically connected with TFTs, the device being characterized in thatthe contact holes have improved cross-sectional shape, whereby reducingmalfunctions of the TFTs which would normally be caused by poor contact.

It is a more specific object of the invention to provide a liquidcrystal display having contacts of improved reliability, whereby theliquid crystal display has improved long-term reliability.

It is another object of the invention to provide a method of fabricatingsemiconductor devices with an improved yield by eliminating pointdefects and line defects.

One aspect of the invention lies in a method of fabricating a thin-filmtransistor comprising a gate region having a gate electrode made of amaterial capable of being anodized and source/drain regions made of asemiconductor. This method comprises the steps of: forming a multilayerinsulating film comprises at least two layers which have a commonconstituent over said gate region and over said source/drain regions;and forming holes in said multilayer insulating film by dry etchingtechniques so as to form tapered sections having tilt angles whichdecrease successively from said top insulating layer toward said bottominsulating layer.

In one feature of the invention, the dry etch rates of the interlayerinsulating films are controlled so as to form tapered sections. As aresult, the tilt angles of the cross-sectional shape of the contactholes decrease successively from the top layer toward the bottom layer.The tilt angles of the bottom layer and the top layer are indicated by αand β, respectively, in FIG. 3.

It is only necessary that the insulating films act only as interlayerinsulating films and so they can be made from various materials such assilicon oxide, silicon nitride, and organic resins.

Preferably, the used material permits easy control of the dry etchrates, because desired taper can be readily accomplished by making theetch rate of the upper layer higher than that of the lower layer.

Generally, where contact holes are formed by dry etching, techniques,reactive ion etching (RIE) is used. However, RIE has the disadvantagethat if the instant (known as endpoint) at which the etching processends is not clear, then a conductive thin film to which contact shouldbe made is also etched away.

In the case of RIE, it is conventional to detect light emission due to aplasma in order to detect the endpoint. Specifically, certain radicalsor ions produced during etching are monitored.

In this case, an interlayer insulating film consisting of silicon oxidewhich is formed on a gate-insulating film made of silicon oxide, forexample, is etched. Light-emitting species to be monitored are mixed.This makes it difficult to confirm the endpoint.

Where the foregoing is taken into consideration, it is necessary that ainsulating film used as an interlayer insulating film be selected,taking full account of the structure of the fabricated TFTs.

Another aspect of the invention lies in a method of fabricating athin-film transistor comprising a gate region having a gate electrodemade of a material capable of being anodized and source/drain regionsmade of a semiconductor. This method comprises the steps of: forming athin film; forming a insulating film having a bottom surface over saidgate region and over said source/drain regions such that said thin filmis in contact with the bottom surface of said insulating film; formingholes in said insulating film by dry etching techniques; etching saidthin film in contact with the bottom surface of said insulating film;and subjecting said holes to a light etching process.

In another feature of the invention, the contact holes are widened bythe light etching process. Tapered section are formed around the tops ofthe contact holes.

If the thin film in contact with the bottom surface of the insulatingfilm is etched by dry etching techniques, the insulating film isundercut because of isotropic etching. Hence, holes are formed. Theundercutting will give rise to overetch, which in turn permits theinterconnect electrodes to break later.

In the present invention, the light etching process can widen thecontact holes by removing the undercutting inside the contact holes.

The light etching process is carried out with a higher O₂ content thanduring the step of forming the contact holes.

This eliminates overetch and, at the same time, causes resist mask forforming the contact holes to be recessed. The corners at the edges (theouter frames around the entrances to the contact holes) are rounded off.

That is, this light etching process results in contact holes having across-sectional shape which falls along a mild curve. Consequently, thecoverage of the interconnect electrodes is quite good.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1(A)-1(D) and 2(A)-2(D) are cross-sectional views of asemiconductor device, illustrating a process sequence for fabricatingthe device by a method according to the present invention;

FIG. 3 is a cross-sectional view of a contact hole formed by the processsequence shown in FIGS. 1(A)-1(D) and 2(A)-2(B);

FIG. 4 is a cross-sectional view of a contact hole as shown in FIG. 2(C) in which corners have been rounded off by a method according to thepresent invention;

FIG. 5 is a graph illustrating the endpoint of a dry etching process;

FIGS. 6(A)-6(C), 7(A)-7(B), and 8(A)-8(B) are cross-sectional viewsillustrating IC fabrication processes according to the invention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Embodiment 1

A process sequence for fabricating TFTs in accordance with the presentinvention is illustrated in FIGS. 1(A)-1(D) and FIGS. 2(A)-2(D).

First, a glass substrate 101 having an insulating film such as a siliconoxide film on its surface is prepared. An amorphous silicon film (notshown) having a thickness of 500 Å is formed on the substrate by plasmaCVD or LP thermal chemical vapor deposition. The amorphous film iscrystallized by an appropriate crystallization method, which may beeither heating or laser illumination.

Then, the crystalline silicon film obtained by crystallizing theamorphous silicon film is patterned into islands of a semiconductorlayer 102 forming an active layer.

A silicon oxide film 103 which will act as a gate-insulating film lateris formed on the semiconductor layer to a thickness of 1200 Å by plasmaCVD or LP thermal chemical vapor deposition.

Then, a film 104 consisting only or mainly of aluminum is formed to athickness of 4000 Å. This film 104 will act as a gate electrode later.Of course, other materials capable of being anodized such as tantalumand niobium may also be used.

Thereafter, anodization is carried out within an electrolytic solution,using the aluminum film 104 as an anode. The electrolytic solution isneutralizing 3% ethylene glycol solution of tartaric acid with aqueousammonia and adjusting it to a pH of 6.92. Using a platinum cathode, theliquid is processed with an electric current of 5 mA. The voltage isincreased up to 10 V.

A dense anodic oxide film 105 formed in this way acts to improve theadhesion to photoresist later. The thickness of the anodic oxide film105 can be controlled by controlling the voltage application time (FIG.1(A)).

Then the aluminum film 104 is patterned to formed a gate electrode (notshown).

Then, a second anodic oxidation process is carried out to form a porousanodic oxide film 106. As an electrolytic solution, 3% aqueous solutionof oxalic acid is used. A platinum cathode is employed. It is processedwith an electric current of 2 to 3 mA. The voltage is increased up to 8V.

At this time, the anodic oxidation progresses parallel to the substrate.The width of the porous anodic oxide film 106 can be controlled by thevoltage application time.

After removing the photoresist with appropriate peeling liquid, a thirdanodic oxidation process is performed, thus obtaining a state shown inFIG. 1(B).

At this time, the electrolytic solution is neutralizing 3% ethyleneglycol solution of tartaric acid with aqueous ammonia and adjusted to apH of 6.92. Using a platinum cathode, the anodic oxidation is performedwith an electric current of 5 to 6 mA. The voltage is increased up to100 V.

The resulting anodic oxide film 107 is very dense and firm. Therefore,this protects the gate electrode 108 from damage in later steps such asimplantation step.

The firm anodic oxide film 107 is not readily etched and so the etchingtime is prolonged when contact holes are formed. Therefore, it isdesired to suppress the thickness of the film below 1000 Å.

Then, a dopant is implanted into the islands of semiconductor layer 102by the ion implantation process. For example, when an N-channel TFT ismanufactured, phosphorus (P) may be used as the dopant.

First, under the condition of FIG. 1(B), a first ion implantationprocess is carried out. Phosphorus (P) is implanted at an acceleratingvoltage of 60 to 90 kV at a dose of 0.2 to 5×10¹⁵ atoms/cm². In thepresent example, the accelerating voltage is 80 kV, and the dose is1×10¹⁵ atoms/cm².

Using the gate electrode 108 and the porous anodic oxide film 106 asmasks. Regions 109 and 110 which will become source/drain regions areformed by self-aligned technology.

Then, as shown in FIG. 1(C), the porous anodic oxide film 106 isremoved, and a second implantation process is performed. The secondincorporation of phosphorus (P) is carried out at an acceleratingvoltage of 60 to 90 kV at a dose of 0.1 to 5×10¹⁴ atoms/cm². In thepresent example, the accelerating voltage is 80 kV, and the dose is1×10¹⁴ atoms/cm².

The gate electrode 108 serves as a mask. Regions 111 and 112 morelightly doped than the source drain 109 and drain region 110 are formedby self-aligned technology.

At the same time, a region 113 acting as a channel for the TFT is formedby self-aligned technology, because no dopant is implanted at all rightunder the gate electrode 108.

The lightly doped drain (LDD) regions 112 formed in this way suppressgeneration of a high electric field between the channel region 113 andthe drain region 110.

Then, irradiating with KrF excimer laser light and thermally annealingare performed. In the present example, the energy density of the laserlight is 250 to 300 mJ/cm². The thermal annealing is carried out at 300to 450° C. for 1 hour.

This step can heal the damage to the crystallinity of the islands ofsemiconductor layer 102 sustained by the ion implantation process.

Then, as shown in FIG. 1(D), two interlayer insulating films 114 and 115are formed by plasma CVD. In the present example, the interlayerinsulating films 114 and 115 are made of silicon nitride films ofdifferent composition ratio.

At this time, the composition ratio of the silicon nitride film formingthe second interlayer insulating film 115 gives a higher dry etch ratethan that of the first interlayer insulating film 114. For example, thefilm of higher etch rate can be formed by increasing the pressure of thefilm-forming gas or the growth temperature or by lowering the RF power.

More specifically, where the first and second films are grown at 250° C.and 350° C., respectively, the dry etch rate of the second layer isapproximately twice as high as the rate of the first layer.

The pressures of the gases for forming the first and second layers,respectively, are set to 0.3 and 0.7 torr, respectively. In this case,the dry etch rate of the second layer is about 1.5 times as high as therate of the first layer.

This is a requirement which must be satisfied in order that the tiltangle β of the second interlayer insulating film 115 be smaller than thetilt angle α of the first interlayer insulating film 114 in the shape ofthe contact hole shown in FIG. 3.

The total thickness of the first and second interlayer insulating filmsis 1 to 3 times as large as the thickness of the gate electrode 108 toimprove the coverage of the interlayer insulating films. Thus, currentleaking via the interlayer insulating films is prevented.

Preferably, the thickness of the first interlayer insulating film 114 isless than one third of the total thickness. If the thickness of thefirst interlayer insulating film is greater than this, the tilt angle αincreases, thus resulting in difficulties in a light etching stepcarried out later.

A resist mask indicated by 201 in FIG. 2(A) is formed, and a contacthole is formed by dry etching techniques. The composition of the etchantgas is so set that CF₄ :O₂ =40:60.

The etching ends when a period of 150 seconds passes since the endpointhas been confirmed. The endpoint is detected as shown in FIG. 5. Thesignal intensity of nitrogen ions from the first layer is greater,because the first layer is denser than the second layer.

At this time, in the source/drain contact regions 202 and 203, thegate-insulating film 103 acts as a film that stops the dry etchingprocess. In the gate electrode region 204, the anodic oxide film 107acts as a film that stops the dry etching process.

Since the second interlayer insulating film 115 is higher in etch ratethan the first interlayer insulating film 114, tapered sections areformed as shown in FIG. 2(A).

Then, the gate-insulating film 103 at the bottom surface of the contacthole is etched with buffered hydrofluoric acid, thus completing thecontact holes in the source/drain regions.

Thereafter, chromium mixed acid solution consisting of mixture ofchromic acid, acetic acid, phosphoric acid, and nitric acid is used toetch the anodic oxide film 107, thus completing the contact hole in thegate electrode region.

Where the gate-insulating film 103 is etched first in this way, the gateelectrode 108 can be protected, since the anodic oxide film 107 hasexcellent resistance to buffered hydrofluoric acid. The chromium mixedacid solution hardly attacks the source region 109 or drain region 110.

In this way, the state shown in FIG. 2(B) is obtained. Wet etching usingbuffered hydrofluoric acid or chromium mixed acid progressesisotropically and so overetched portions as shown in the circles of FIG.2(B) are formed.

The interlayer insulating films are recessed by light etching, thuseliminating overetched portions, as shown in FIG. 2(C). At this time, asthe tilt angle α of the first interlayer insulating film 114 decreases,the film can be more easily recessed.

This light etching process is carried out by dry etching techniques. Thecomposition of the etchant gas is so set that CF₄ :O₂ =25:75. With thiscomposition, the selectivity of silicon nitride with respect to siliconis more than 10. Hence, the surfaces of the source region 109 and drainregion 110 are hardly etched.

This light etching is carried out by the gas with a high O₂ content.Therefore, the resist mask 201 is recessed simultaneously. Consequently,the corners of the cross-sectional shape at the edges of the contacthole are etched away and rounded off, as shown in the circle of FIG. 4.

After the completion of the contact hole, interconnect electrodes 205,206, and 207 are formed. Then annealing is performed in a hydrogenambient at 350° C. for 2 hours.

A thin-film transistor as shown in FIG. 2(D) is fabricated by performingthe steps described above.

Embodiment 2

The present example is an example of application of the presentinvention to an IC fabrication process using single-crystal siliconwafer. More specifically, this is an example of fabrication of a MOStransistor. using the silicon wafer.

The process sequence of the present invention is shown in FIGS.6(A)-6(C), 7(A)-7(B), and 8(A)-8(B). First, as shown in FIG. 6(A), athermal oxide film and a silicon nitride film are laminated over anN-type single-crystal silicon wafer 601 and patterned to create apatterned lamination of the thermal oxide film 602 and silicon nitridefilm 603.

Then, field oxide films 604 and 605 are formed by a selective thermaloxidization method. Thus, a state shown in FIG. 6(A) is obtained.

Then, the thermal oxide film 602 and the silicon nitride film 603 areremoved. A thermal oxide film 606 is formed again by thermal oxidation.This thermal oxide film 606 forms a gate-insulating film.

Thereafter, a gate electrode 607 is fabricated from an appropriate metalmaterial, silicide material, or semiconductor material. Subsequently,dopants are implanted to form source/drain regions.

In this example, boron (B) ions are introduced through ion implantationto fabricate a P-channel MOS transistor. If an N-channel MOS transistoris fabricated, phosphorus (P) ions may be introduced.

After the ion implantation described above, a heat-treatment is made toactivate the introduced dopants and to anneal out damage to thesemiconductor layer caused by the ion implantation.

In this way, a P-type source region 608 and a drain region 609 areformed by self-aligned technology, as shown in FIG. 6(B).

Then, silicon nitride films 610 and 611 are formed as interlayerinsulating films. In the same way as in Example 1, the silicon nitridefilms 610 and 611 have such film properties that the film 611 has ahigher etch rate than the below film 610.

A state shown in FIG. 6(C) is obtained in this manner. Then, as shown inFIG. 7(A), a resist mask 612 is placed. Contact holes 613 and 614 areformed by dry etching techniques.

A state shown in FIG. 7(A) is obtained in this way. At this time thegate-insulating film 606 consisting of a thermal oxide film acts as anetch stopper.

Contact holes 615 and 616 are then formed by wet etching techniques.

In this manner, a state shown in FIG. 7(B) is obtained. At this time wetetching proceeds isotropically and so the contact holes 615 and 616widen the bottoms of the contact holes 613 and 614, respectively.

Then, the interlayer insulating films and resist mask are recessed bylight dry etching, using mixture of CF₄ and O₂. The oxygen is added,because the resist mask should be recessed.

In this way, contacts having a mild cross-sectional shape as shown inFIG. 8(A) can be obtained. After obtaining the state shown in FIG. 8(A),a source electrode 619 and a drain electrode 620 are formed as shown inFIG. 8(B), thus completing a MOS transistor.

In the present invention, the interlayer insulating film is made of amultilayer structure consisting of two or more layers. The etch rate ofan upper layer is made higher than that of a lower layer. Therefore,tapered section can be formed in such a way that the tilt angledecreases successively from the top layer of the interlayer insulatingfilm toward the bottom layer.

Furthermore, undercutting of the gate-insulating film 103 and of theanodic oxide film 107 as shown in the circles of FIG. 2(B) can beprevented. In addition, the cross-sectional shape around the top of eachcontact hole can be improved as shown in FIGS. 2(C) and 3.

The cross-sectional shape of the contact hole can be improved greatly bythe effects described above. The yield at which TFTs are fabricated andthe reliability of interconnect contacts are enhanced. Concomitantly,the long-term reliability of the devices and display system can beenhanced.

What is claimed is:
 1. A method for fabricating a semiconductor devicecomprising the steps of:forming a semiconductor film on an insulatingsurface, said semiconductor film having at least channel, source anddrain regions therein; forming a first insulating film on saidsemiconductor film; forming a second insulating film on said firstinsulating film, said second insulating film comprising a differentmaterial from said first insulating film; forming a first opening insaid second insulating film by etching to expose a portion of said firstinsulating film in said first opening; forming a second opening in saidfirst insulating film in order to expose a portion of said semiconductorfilm by etching the portion of said first insulating film exposed insaid first opening using a liquid etchant whereby a portion of saidsecond insulating film projects over said second opening; removing theprojecting portion of said second insulating film by etching.
 2. Themethod according to claim 1, wherein said first insulating filmcomprises silicon oxide.
 3. The method according to claim 1, whereinsaid second insulating film comprises a material selected from the groupconsisting of silicon nitride and organic resin.
 4. The method accordingto claim 1, wherein said second insulating film comprises at least twolaminated layers including an upper layer and a lower layer.
 5. Themethod according to claim 4, wherein said first opening has taperedconfiguration and said upper layer has a higher degree of tapering thansaid lower layer.
 6. The method according to claim 1, wherein saidliquid etchant comprises buffered hydrofluoric acid.
 7. The methodaccording to claim 1, wherein the etching of said projecting portion isconducted by dry etching with an etching gas comprising carbontetrafluoride and oxygen.
 8. A method for fabricating a semiconductordevice comprising the steps of:forming a semiconductor film on aninsulating surface, said semiconductor film having at least channel,source and drain regions therein; forming a first insulating film onsaid semiconductor film; forming an interlayer insulating film over saidsemiconductor film and said first insulating film, said interlayerinsulating film comprising a different material from said firstinsulating film; forming a first opening in said interlayer insulatingfilm by etching to expose a portion of said first insulating film insaid first opening; forming a second opening in said first insulatingfilm in order to expose a portion of said semiconductor film by etchingthe portion of said first insulating film exposed in said first openingusing a liquid etchant whereby a portion of said interlayer insulatingfilm projects over said second opening; removing the projecting portionof said interlayer insulating film by etching.
 9. The method accordingto claim 8, wherein said first insulating film comprises silicon oxide.10. The method according to claim 8, wherein said interlayer insulatingfilm comprises a material selected from the group consisting of siliconnitride and organic resin.
 11. The method according to claim 8, whereinsaid interlayer insulating film comprises at least two laminated layersincluding an upper layer and a lower layer.
 12. The method according toclaim 11, wherein said first opening has a tapered configuration andsaid upper layer has a higher degree of tapering than said lower layer.13. The method according to claim 8, wherein said liquid etchantcomprises buffered hydrofluoric acid.
 14. The method according to claim8, wherein the etching of said projecting portion is conducted by dryetching with an etching gas comprising carbon tetrafluoride and oxygen.15. A method for fabricating a semiconductor device comprising the stepsof:forming a semiconductor film on an insulating surface, saidsemiconductor film having at least channel, source and drain regionstherein; forming a first insulating film on said semiconductor film;forming a second insulating film on said first insulating film, saidsecond insulating film comprising a different material from said firstinsulating film; forming a first opening in said second insulating filmby first dry etching using a first etching gas containing oxygen toexpose a portion of said first insulating film in said first opening;forming a second opening in said first insulating film in order toexpose a portion of said semiconductor film by etching the portion ofsaid first insulating film exposed in said first opening using a liquidetchant whereby a portion of said second insulating film projects oversaid second opening; removing the projecting portion of said secondinsulating film by second dry etching using a second etching gascontaining oxygen, andwherein a proportion of the oxygen in said secondetching gas is higher than a proportion of the oxygen in said firstetching gas.
 16. The method according to claim 15, wherein said firstinsulating film comprises silicon oxide.
 17. The method according toclaim 15, wherein said second insulating film comprises a materialselected from the group consisting of silicon nitride and organic resin.18. The method according to claim 15, wherein said second insulatingfilm comprises at least two laminated layers including an upper layerand a lower layer.
 19. The method according to claim 18, wherein saidfirst opening has tapered configuration and said upper layer has ahigher degree of tapering than said lower layer.
 20. The methodaccording to claim 15, wherein said liquid etchant comprises bufferedhydrofluoric acid.
 21. The method according to claim 15, wherein each ofsaid first and second etching gas comprises said oxygen and carbontetrafluoride.
 22. A method for fabricating a semiconductor devicecomprising the steps of:forming a semiconductor film on an insulatingsurface, said semiconductor film having at least channel, source anddrain regions therein; forming a first insulating film on saidsemiconductor film; forming an interlayer insulating film consisting ofa plurality of insulating layers over said semiconductor film and saidfirst insulating film; first etching said interlayer insulating film toexpose a portion of said first insulating film in an opening; secondetching the portion of said first insulating film exposed by said firstetching to expose a portion of said semiconductor film in said opening,whereby a portion of said interlayer insulating film projects over saidopening; and removing the projecting portion of said interlayerinsulating film by etching,wherein at least one of said plurality ofinsulating layers in said interlayer insulating layer comprises organicresin.
 23. The method according to claim 22 wherein said firstinsulating film comprises silicon oxide.
 24. The method according toclaim 22 wherein another one of said plurality of insulating layers insaid interlayer insulating layer comprises silicon nitride.
 25. Themethod according to claim 22 wherein said second etching is performedusing said liquid etchant comprising buffered hydrofluoric acid.
 26. Themethod according to claim 22 wherein the removing of said projectingportion is conducted by dry etching with an etching gas comprisingcarbon tetrafluoride and oxygen.
 27. The method according to claim 22wherein said source and drain regions are doped with phosphorus at adose of 0.2 to 5×10¹⁵ atoms/cm², respectively.